Samsung outlined its foundry business roadmap for the next five years at its Foundry Forum event last week. The company plans to introduce its next generation fabrication technologies in a timely manner and intends to make chips on its 1.4 nm (14 angstroms) manufacturing process by 2027. Also, the company will keep investing in new manufacturing capacity going forward as it strives to strengthen its position in the foundry market. New Nodes Incoming Samsung has been introducing new production nodes and/or variants on production nodes every 12 – 18 months for several years now, and plans to keep its rather aggressive pace going forward. Though the company’s roadmap illustrates, fanfare aside, that it is now taking longer to develop new fabrication processes. The company’s second-generation 3...
Despite most discussion about chip manufacturing focusing on the leading edge and blazingly fast and complex side of the industry, the demand for the ‘legacy’ process technologies is also...11 by Dr. Ian Cutress on 10/6/2021
Toshiba in the past week has finalized plans to build a new production facility to make 3D NAND flash memory. The company will start construction in early 2017 and...8 by Anton Shilov on 11/15/2016
Toshiba this month has announced plans to build a new manufacturing facility to produce its BiCS NAND flash memory. The company intends to start making chips at the new...5 by Anton Shilov on 3/25/2016