Through financial channels, Intel this week announced that it would hold a datacenter-related event for financial analysts, technology, analysts and the tech press next week in Santa Clara. There is potential for the company may make several important announcements regarding its datacenter products at the conference.

Intel’s Data-Centric Innovation Summit will be held on August 8 at Intel’s headquarters in Santa Clara. Key presentations from the event will be webcast, so people around the world will be able to see all the announcements and understand Intel’s vision concerning next-generation datacenters.

What to expect from Intel’s Data-Centric Innovation Summit is an interesting question. Since datacenters today solve different problems, from streaming movies over the Internet to processing financial transactions to solving complex mathematical tasks, we expect Intel to talk about its different technologies that enable datacenters for various purposes and success stories. However the meaty bit should be if anything is announced, or roadmaps are confirmed.

In particular, it is possible that Intel will talk about its forthcoming CPUs and FPGAs for mainstream as well as HPC servers. The chipmaker will also likely talk about its Optane products featuring 3D XPoint memory, though it is unclear whether it is going to touch upon next-generation 3D XPoint which was recently revealed in a roadmap. In fact, storage in general is gaining importance in the datacenter, so it will probably be a part of the conversation, given that the Flash Memory Summit conference is also happening at the same time.

From last week’s leak about Intel’s Cooper Lake-SP and Ice Lake-SP processors we also know that Intel considers various AI/DL/ML solutions as integral parts of its datacenter strategy, so it is highly likely that we are going to hear something about these products too. Besides, Intel could talk about its upcoming quantum computing efforts (e.g., Tangle Lake test chip) as the era of quantum computing is coming closer (not that it is ready for prime time though).

Intel’s Data-Centric Innovation Summit to a degree will be a substitute for the server-related sessions we used to have at the Intel Developer Forum tradeshow, which was usually held around this time of the year but  discontinued back in 2017. Keep in mind that in addition to this event there will be two important conferences this month: Flash Memory Summit on August 7 – 8 as well as Hot Chips on August 19 – 21. Being a big company, Intel will be at both events, but at present we cannot tell you what exactly to expect from the company and whether anything exclusive will be revealed at HC and FMS. At Hot Chips, Intel has a talk titled 'Intel’s High Performance Graphics solutions in thin and light mobile form factors', and you can follow our live blog on AnandTech as it happens.

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Source: Intel

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  • Cooe - Saturday, August 4, 2018 - link

    Rofl, and with the ever increasing heat in the frying pan, OF COURSE the Intel Defense Force™ is making the rounds. It's time to wake up and smell the roses, and by roses I mean the MASSIVE 10nm dumpster fire.
  • iwod - Friday, August 3, 2018 - link

    >At Hot Chips, Intel has a talk titled 'Intel’s High Performance Graphics solutions in thin and light mobile form factors'

    That sounds Interesting.

    I hope analyst will ask more about their 10nm situation. As well as 7nm progress. And Icelake. They have been talking about FPGAs and hasn't shown anything useful yet.
  • IntelUser2000 - Friday, August 3, 2018 - link

    It sounds like a Kabylake-G presentation.
  • iwod - Saturday, August 4, 2018 - link

    Yes. there used to be a time ( or for as long as I could remember ) Intel had the quality and mostly Integrity on the engineering side. Now they just keep lying.
  • HStewart - Saturday, August 4, 2018 - link

    "It sounds like a Kabylake-G presentation."

    I actually own a Kabylake-G, a Dell XPS 15 2in1, I would say that CPU is awesome and most power notebook or any machine that I personally own.

    But I the graphics on it is questionable - I am an aging gamer and - built machines earlier - but I grown up and desire laptops - I also enjoy professional graphics and includes applications like Lightwave 3d, Vue, Photoshop and others. As for games older games have trouble on GPU and even Steam's VR test has trouble. Also so far Lightwave 3d 2018 is fine but Vue 16 2016 has trouble with graphics.

    I took a risk with graphics on the copy - and I wish Intel join with NVidia on graphics - but as a 2in1. the Dell XPS 15 2in1 in an awesome computer with it 4k screen and right now it connect to a LG 34U88 monitor.

    But if Intel engineering on the data center is anything like 9805g in my XPS 15 2in1 then Intel is going to have no problem in the future no matter what nm the completion runs.
  • Santoval - Monday, August 6, 2018 - link

    Are you suggesting that the GPU is weak or that it does not play along well with the Intel CPU, perhaps due to an immature first gen implementation, unoptimized drivers, lack of optimization from games and programs, or some combination of these?
    Which "older games" did you try, and at what resolution and settings? There can be a few old games which can bleed resources dry at 4K resolution and high/max settings. I have no idea what Vue is, but its version/year also suggests a lack of updates and optimization.
  • FreckledTrout - Saturday, August 4, 2018 - link

    I want to hear what they have to compete with AMD's EPYC on TSMC's 7nm process. As far as I can tell they have a full year or more with nothing that will compete with EPYC once its lands.
  • watzupken - Monday, August 6, 2018 - link

    I think that is if 10nm is ready by 2019 despite what Intel claims. They have been delaying it year on year since 2016 I believe. To be honest, I feel Intel's 14nm is still competitive with even 7nm out there, just that they will have to work harder since the advantage is no longer there for them.
  • Santoval - Monday, August 6, 2018 - link

    They will pit Cascade Lake SP & AP against it. The SP series is basically a refresh of the Skylake SP series, it even uses the same platform and socket. It adds a + to the process and should support a bit higher clocks, but the layout will be exactly the same, with perhaps a neural network block with tensor cores added (that will likely have to wait for Cooper Lake).

    The AP series though, which is expected later, is brand new, not in the sense of employing new cores or a new arch (God no, it will still be Skylake based), but of moving to multi-die (MCM) packages via EMIB, along with a new platform and socket of course.
    Intel will have the option of using two to four LCC, HCC or XCC dies in the AP series, or two to four 10-core, 18-core or 28-core dies respectively, i.e. from 20 to a max of 112 (rounded to 110) cores.
    Cascade and Cooper Lake AP should top at 56 cores or, rather unlikely, a max of 72 cores (via two 28-core dies or four 18-core ones). Ice Lake AP, much later, might add even more cores because it will be able to afford it, space-wise, due to its 2.5+ times higher density.

    Therefore, only AP series Intel CPUs should be able to compete with Epyc 2, by providing more than 28 cores per socket. Suffice to say that these CPUs are going to cost an arm, a leg and a kidney. I predict that a 36-core (2x18-core dies) CPU from Intel will cost about as much as a 64-core one from AMD, assuming AMD releases such a CPU in 2019 or 2020.

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