TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany. The new 300-mm fab will produce chips on TSMC's 28/22 nm and 16/12 nm-class process technologies, primarily for automotive and industrial sectors. As the project is planned under the European Chips Act framework, TSMC is set to get subsidies to build it. The proposed ESMC fab will be located near Dresden, Germany, and is slated to have a monthly production capacity of 40,000 300mm wafer starts per month. The fab is set to use TSMC's 28 nm family of production nodes, which includes several specialty manufacturing technologies and a 22 nm low-power fabrication process with planar...

Bosch and NVIDIA Team Up for Xavier-Based Self-Driving Systems for Mass Market Cars

Bosch and NVIDIA on Thursday announced plans to co-develop self-driving systems for mass-market vehicles. The solutions will use NVIDIA’s next-generation codenamed Xavier SoC as well as the company’s AI-related...

43 by Anton Shilov on 3/18/2017

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