One of the big announcements at AMD’s Data Center event a couple of weeks ago was the announcement of its CDNA2 based compute accelerator, the Instinct MI250X. The MI250X uses two MI200 Graphics Compute Dies on TSMC’s N6 manufacturing node, along with four HBM2E modules per die, using a new ‘2.5D’ packaging design that uses a bridge between the die and the substrate for high performance and low power connectivity. This is the GPU going into Frontier, one of the US Exascale systems due for power on very shortly. At the Supercomputing conference this week, HPE, under the HPE Cray brand, had one of those blades on display, along with a full frontal die shot of the MI250X. Many thanks to Patrick Kennedy from...
After the Computex Keynote today on stage, where AMD revealed its new Ryzen family of processors coming on 7/7, we had a chance to speak with AMD’s SVP and...16 by Ian Cutress on 5/27/2019
The history of the computing industry is one of constant progress. Processors get faster, storage gets cheaper, and memory gets denser. We see the repercussions of this advancement through...77 by Ryan Smith on 5/7/2019