HBM

Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks, just hours after Micron said it had kicked off mass production of its 8-Hi 24 GB HBM3E memory products. The new memory packages, codenamed Shinebolt, increase peak bandwidth and capacity compared to their predecessors, codenamed Icebolt, by over 50% and are currently the world's fastest memory devices. As the description suggests, Samsung's Shinebolt 12-Hi 36 GB HBM3E stacks pack 12 24Gb memory devices on top of a logic die featuring a 1024-bit interface. The new 36 GB HBM3E memory modules feature a data transfer rate of 10 GT/s and thus offer a peak bandwidth of 1.28 TB/s per stack, the industry's highest per-device (or rather per-module) memory...

Micron Kicks Off Production of HBM3E Memory

Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...

7 by Anton Shilov 3 days ago

Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps

Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...

10 by Ryan Smith on 10/20/2023

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...

11 by Anton Shilov on 10/12/2023

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...

7 by Anton Shilov on 9/28/2023

Memory Makers on Track to Double HBM Output in 2023

TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...

9 by Anton Shilov on 8/9/2023

Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext

In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...

4 by Anton Shilov on 7/27/2023

Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors

Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...

7 by Anton Shilov on 7/26/2023

As The Demand for HBM Explodes, SK Hynix is Expected to Benefit

The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...

9 by Anton Shilov on 4/18/2023

Intel Showcases Sapphire Rapids Plus HBM Xeon Performance at ISC 2022

Alongside today’s disclosure of the Rialto Bridge accelerator, Intel is also using this week’s ISC event to deliver a brief update on Sapphire Rapids, the company’s next-generation Xeon CPU...

22 by Ryan Smith on 5/31/2022

Intel to Launch Next-Gen Sapphire Rapids Xeon with High Bandwidth Memory

As part of today’s International Supercomputing 2021 (ISC) announcements, Intel is showcasing that it will be launching a version of its upcoming Sapphire Rapids (SPR) Xeon Scalable processor with...

150 by Dr. Ian Cutress on 6/28/2021

2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package

High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...

35 by Andrei Frumusanu on 8/25/2020

Micron to Launch HBM2 DRAM This Year: Finally

Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...

14 by Anton Shilov on 3/27/2020

AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D

One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...

12 by Dr. Ian Cutress on 3/5/2020

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

9 by Anton Shilov on 2/11/2020

Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2

Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...

11 by Anton Shilov on 10/7/2019

Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps

Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well...

25 by Anton Shilov on 3/20/2019

JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack

JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...

15 by Anton Shilov on 12/19/2018

Xilinx Announces Project Everest: The 7nm FPGA SoC Hybrid

This week Xilinx is making public its latest internal project for the next era of specialized computing. The new product line, called Project Everest in the interim, is based...

16 by Ian Cutress on 3/19/2018

Samsung Starts Production of HBM2 “Aquabolt” Memory: 8 GB, 2.4 Gbps

Samsung this week announced that it had started mass production of its second-generation HBM2 memory code-named “Aquabolt”. The new memory devices have 8 GB capacity and operate at 2.4...

17 by Anton Shilov on 1/11/2018

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